Lasertec Corporation (6920.T) Stock
Technology · Semiconductor Equipment & Materials · Member of Nikkei 225
Lasertec Corporation (6920.T) closed at JPY 39,220.00 on 2026-10-15, a change of +67.8 % over the past year, with a market capitalization of JPY 3.71T.
Lasertec Corporation recent closing prices
| Date | Close (JPY) |
|---|---|
| 2026-10-15 | 39,220.00 |
| 2026-10-14 | 45,370.00 |
| 2026-10-13 | 46,090.00 |
| 2026-10-12 | 46,090.00 |
| 2026-10-09 | 48,560.00 |
| 2026-10-08 | 46,610.00 |
| 2026-10-07 | 46,700.00 |
The most recent trading day is not shown. For full charts and indicators use the analysis page.
Lasertec Corporation key figures
- Previous close
- JPY 39,220.00 (2026-10-15)
- 1-year change
- +67.8 %
- Market cap
- JPY 3.71T
- Enterprise value
- JPY 3.43T
- P/E ratio (trailing)
- 55.45
- P/E ratio (forward)
- 37.84
- EPS (trailing)
- 745.38
- EPS (forward)
- 1,092.17
- PEG ratio
- 2.68
- Price to book
- 15.01
- Revenue growth
- -26.3 %
- Earnings growth
- -34.9 %
- Dividend per share (trailing)
- 329.00
- Short ratio
- n/a
- Employees
- 1,335
- Analyst consensus (third-party)
- buy
Source: Yahoo Finance via yfinance. Data may be delayed, incomplete or incorrect.
About Lasertec Corporation
Lasertec Corporation engages in the design, manufacture, and sale of inspection and measurement equipment in Japan, South Korea, Taiwan, Other Asia, the United States, and Europe. The company offers semiconductor related products, including Actinic EUV patterned mask inspection system, EUV mask blanks inspection and review system, mask inspection system, mask blanks inspection and review system, EUV pellicle inspection system, EUV mask backside inspection and cleaning system, and mask edge inspection system; phase-shift and transmittance measurement system, and phase-shift measurement system; SiC wafer inspection and review system, GaN wafer inspection and review system, high sensitivity under-layer defect inspection and review system, multi-wavelength wafer inspection system, high sensitivity wafer edge inspection system, wafer edge-dimension measurement system, via depth measurement system, TSV back grinding process measurement system, and automated wafer measurement system. It also provides FPD photomask inspection system, pellicle inspection and pellicle mounting system for CLIOS, and FPD mask blanks inspection system; and microscopes, such as laser microscopes, automatic inspection and review system, infrared confocal microscope, electro-chemical reaction visualizing confocal system, and in-situ observation at ultra-high temperature confocal scanning laser microscope. The company was formerly known as NJS Corporation and changed its name to Lasertec Corporation in 1986. Lasertec Corporation was founded in 1960 and is headquartered in Yokohama, Japan.
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