Amkor Technology, Inc. (AMKR) Stock

Technology · Semiconductor Equipment & Materials · Member of Other US Stocks

Amkor Technology, Inc. (AMKR) closed at USD 44.82 on 2026-10-14, a change of +40.3 % over the past year, with a market capitalization of USD 10.92B.

Amkor Technology, Inc. recent closing prices

The most recent trading day is not shown. For full charts and indicators use the analysis page.

Amkor Technology, Inc. key figures

Previous close

USD 44.82 (2026-10-14)

1-year change

+40.3 %

Market cap

USD 10.92B

Enterprise value

USD 11.14B

P/E ratio (trailing)

21.38

P/E ratio (forward)

15.70

EPS (trailing)

2.06

EPS (forward)

2.81

PEG ratio

0.76

Price to book

2.35

Revenue growth

25.6 %

Earnings growth

218.2 %

Dividend per share (trailing)

0.33

Short ratio

2.73

Employees

30,800

Analyst consensus (third-party)

none

Source: Yahoo Finance via yfinance. Data may be delayed, incomplete or incorrect.

About Amkor Technology, Inc.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Technical indicators and comparison

Show RSI, MACD, EMA, CCI and ADX for Amkor Technology, Inc. and compare it with other stocks.