ChipMOS TECHNOLOGIES INC. (IMOS) Stock

Technology · Semiconductors · Member of Other US Stocks

ChipMOS TECHNOLOGIES INC. (IMOS) closed at USD 69.19 on 2026-10-14, a change of +201 % over the past year, with a market capitalization of USD 2.26B.

ChipMOS TECHNOLOGIES INC. recent closing prices

DateClose (USD)
2026-10-1469.19
2026-10-1372.24
2026-10-1275.19
2026-10-0977.73
2026-10-0875.50
2026-10-0778.60
2026-10-0678.39

The most recent trading day is not shown. For full charts and indicators use the analysis page.

ChipMOS TECHNOLOGIES INC. key figures

Previous close
USD 69.19 (2026-10-14)
1-year change
+201 %
Market cap
USD 2.26B
Enterprise value
USD 5.69B
P/E ratio (trailing)
34.28
P/E ratio (forward)
64.50
EPS (trailing)
1.90
EPS (forward)
1.01
PEG ratio
n/a
Price to book
2.96
Revenue growth
28.7 %
Earnings growth
n/a
Dividend per share (trailing)
1.23
Short ratio
1.44
Employees
n/a
Analyst consensus (third-party)
none

Source: Yahoo Finance via yfinance. Data may be delayed, incomplete or incorrect.

About ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People's Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package; and substrate-based packages, including FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF; and testing solutions comprising professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation system for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices. It also provides bumping services; intellectual property management and enabling technologies; and turnkey services, such as wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment to display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

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