Kulicke and Soffa Industries, Inc. (KLIC) Stock
Technology · Semiconductor Equipment & Materials · Member of Other US Stocks
Kulicke and Soffa Industries, Inc. (KLIC) closed at USD 84.51 on 2026-10-14, a change of +108.7 % over the past year, with a market capitalization of USD 4.35B.
Kulicke and Soffa Industries, Inc. recent closing prices
| Date | Close (USD) |
|---|---|
| 2026-10-14 | 84.51 |
| 2026-10-13 | 88.54 |
| 2026-10-12 | 88.39 |
| 2026-10-09 | 92.01 |
| 2026-10-08 | 90.92 |
| 2026-10-07 | 94.95 |
| 2026-10-06 | 97.92 |
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Kulicke and Soffa Industries, Inc. key figures
- Previous close
- USD 84.51 (2026-10-14)
- 1-year change
- +108.7 %
- Market cap
- USD 4.35B
- Enterprise value
- USD 3.87B
- P/E ratio (trailing)
- 40.51
- P/E ratio (forward)
- 14.07
- EPS (trailing)
- 2.05
- EPS (forward)
- 5.90
- PEG ratio
- 2.38
- Price to book
- 4.77
- Revenue growth
- 122.6 %
- Earnings growth
- n/a
- Dividend per share (trailing)
- 0.82
- Short ratio
- 2.95
- Employees
- 2,551
- Analyst consensus (third-party)
- none
Source: Yahoo Finance via yfinance. Data may be delayed, incomplete or incorrect.
About Kulicke and Soffa Industries, Inc.
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors. It also offers ball bonding equipment, wafer level bonding equipment, and wedge-related bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares, and services for equipment. In addition, the company services, maintains, repairs, and upgrades equipment; and sells consumable aftermarket solutions and services. It serves integrated device manufacturers, outsourced wedge and wedge semiconductor assembly and test providers, other electronics manufacturers, foundry service providers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. The company was founded in 1951 and is headquartered in Singapore.
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